Konu "Packaging" için listeleme
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An FEM Study of Die Attach Packaging Effect on Nanomechanical Si Optical Filters
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)This paper presents a finite element analysis of die attach packaging stress effect on emerging nanomechanical silicon optical filters. The proposed silicon optical filter is composed of Si waveguides and a microring ...