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Investigations of Electrical Resistivity and Thermal Conductivity Dependences on Growth Rate in the Al-Cu-Ti Eutectic Alloy
(SPRINGER/PLENUM PUBLISHERS233 SPRING ST, NEW YORK, NY 10013, 2021)
Directional solidification of Al-Cu-Ti (Al-33wt%Cu-0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 mu m.s(-1)) at a temperature gradient of 6.45 K.mm(-1) using Bridgman-type directional ...
