Ara
Toplam kayıt 17, listelenen: 11-17
Emotional State Analysis from EEG signals via Noise-Assisted Multivariate Empirical Mode Decomposition Method
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
Emotional state analysis is an interdisciplinary arena because of the many parameters that encompass the complex neural structure and electrical signals of the brain and in terms of emotional state differences. In recent ...
Interface Engineering in Organic Thin Film Transistors
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
A novel semiconductor, the small molecule C6-NTTN, was used to fabricate organic thin film transistors (OTFTs). Different architectures and deposition techniques were employed, together with various surface treatments of ...
Open Source Slurm Computer Cluster System Design and a Sample Application
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
Cluster computing combines the resources of multiple computers as they act like a single high-performance computer. In this study, a computer cluster consisting of Lustre distributed file system with one cluster server ...
The effect of fourth color component on enhancement of color gamut
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
In this work, we simulate and analyse the peak emission wavelength and full-width-at-half-maximum (FWHM) parameters of nano emitters using four-color mixing approach to provide a tetragonal area as large as possible in ...
Design of capacitive micromachined ultrasonic transducers (CMUTs) on a flexible substrate for intravascular ultrasonography (IVUS) applications
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
Effects of substrate bending to the characteristics of capacitive miniaturized ultrasonic transducers (CMUTs) on a flexible substrate are studied through finite element analysis (FEA) for the design purpose. The target ...
Combining Classifiers for Protein Secondary Structure Prediction
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
Protein secondary structure prediction is an important step in estimating the three dimensional structure of proteins. Among the many methods developed for predicting structural properties of proteins, hybrid classifiers ...
An FEM Study of Die Attach Packaging Effect on Nanomechanical Si Optical Filters
(IEEE345 E 47TH ST, NEW YORK, NY 10017 USA, 2017)
This paper presents a finite element analysis of die attach packaging stress effect on emerging nanomechanical silicon optical filters. The proposed silicon optical filter is composed of Si waveguides and a microring ...